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Termal conductive paste H 7g tube, Silicone AG TermoPasty
Termal conductive paste H 7g tube
Thermally conductive paste series H, from AG TermoPasty, capacity 7g. Paste designed for thermal conduckt between radiator and electric devices. Thermal conductivity is 0.88 W/mK. It does not conduct electricity, protects against short circuits. Work temperature is -55/250°C. Immune for oxidation and resistant to water solutions of acids, bases and salts: sulfur and ammonia.
Availability: Available >20 pcs
Thermal conductive silicone paste H 100g
Thermal paste H is designed to improve the heat flow between electronic components and the heat sink in various temperature sensors, ensuring their proper operation. It protects against weather conditions and prevents punctures. It shows good resistance to oxidation and the effects of aqueous solutions of acids, bases and salts. The product has a wide operating temperature range from -50°C to 250°C, it works well in a wide range of applications.
Availability: Available 10-20 pcs
Thermally conductive paste HP 100g
Thermally conductive paste HP 100g - by AG TermoPasty for use in electronics as a heat conductor between electronics and a heat sink. It shows good heat conduction properties and resistance to overvoltage, weather conditions, oxidation and water solutions of acids and bases. The operating temperature is from -50 ° C to 250 ° C. Suitable for use in household appliances, electronic components, power converters, storage drives, temperature sensors and much more.
Availability: Available 10-20 pcs
AG Thermopad 20x130x1,0 (6 W/mK)
AG Thermopad 20x130x1,0 (6 W/mK)
Double-sided adhesive, conducts heat where the thermal paste cannot be used. It is soft and flexible, thanks to which it adapts to the surface.
Availability: Available - <10 pcs
AG Golg 3 g Thermally conductive paste
AG Golg 3g - thermally conductive paste with gold content. It is characterized by high thermal conductivity of > 2.8 W / mK. Paste can l lower temperature of CPU even by 6°C, without replacement of radiator. Work temperature -50°C/250°C.
Availability: Available - <10 pcs
HPX thermal conductive paste 100g optimization of heat flow, temperature stability
HPX thermal paste from AG TermoPasty is a modern product designed to improve thermal conductivity in a wide range of electronic devices. Its main task is to optimize the heat flow between electronic components and cooling systems, such as heat sinks, which ensures long-term and trouble-free operation of components. Thanks to the unique mixture of ingredients, the paste is characterized not only by excellent thermal conductive properties, but also resistance to various external factors.
Availability: Available - <10 pcs
Thermal break adhesive in a tube 120g AG TermoGlue, mounting heat sinks on bridges, connecting gaps
AG Termoglue thermally conductive glue in a tube is an adhesive that has excellent heat conduction properties. Perfect for mounting radiators and other elements in places with high thermal emission. Its white formula not only ensures effective heat conduction, but also creates a solid protective barrier, increasing the durability and reliability of connections.
Availability: Ask for availability and price
Thermal conductive silicone paste H 0.5g wide temperature range
Pasta termoprzewodząca H ma za zadanie usprawnienie przepływu ciepła pomiędzy elementami elektronicznymi a radiatorem w różnego czujnikach temperatury, zapewniając ich właściwe działanie. Zabezpiecza przed działaniem czynników atmosferycznych oraz zapobiega przebiciom. Wykazuje dobrą odporność na utlenianie oraz oddziaływanie wodnych roztworów kwasów, zasad oraz soli. Produkt ma szeroki zakres temperatur pracy od -50°C do 250°C, sprawdza się w szerokim wachlarzu zastosowań.
Availability: Available - <10 pcs
Thermal conductive silicone paste H 1kg wide temperature range
The thermal conductive paste H is designed to improve the heat flow between electronic components and the heat sink in various temperature sensors, ensuring their proper operation. It protects against weather conditions and prevents punctures. It shows good resistance to oxidation and the effects of aqueous solutions of acids, bases and salts. The product has a wide operating temperature range from -50°C to 250°C, it works well in a wide range of applications.
Availability: Available - <10 pcs
AG Copper 1.5 ml heat conductive paste, copper based, odorless, syringe
AG Copper is a unique, odorless thermal paste. Mainly based on copper, it benefits various cooling systems, especially when it comes to optimizing the processor-heatsink connection. This unique paste offers an effective solution that effectively increases cooling efficiency by improving heat conduction.
Availability: On order
AG Extreme 1g thermal paste, dialectic paste, easy application, LEDs
AG Extreme is an innovative thermal paste that provides exceptional thermal conductivity between various components, such as a heat sink, fan, CPU or GPU. This dielectric paste (i.e. non-conductive) guarantees protection against various electrical hazards, which is invaluable in a computer environment. Thanks to its ease of application, this product is trouble-free to use and can be applied to a variety of computer hardware components, including LEDs.
Availability: On order
AG Extreme 3g thermal paste, dialectic paste, easy application, LEDs
AG Extreme is an innovative thermal paste that provides exceptional thermal conductivity between various components, such as a heat sink, fan, CPU or GPU. This dielectric paste (i.e. non-conductive) guarantees protection against various electrical hazards, which is invaluable in a computer environment. Thanks to its ease of application, this product is trouble-free to use and can be applied to a variety of computer hardware components, including LEDs.
Availability: On order
AG Gold 1g Thermal paste, syringe
AG Golg 1g - thermal paste with gold content. It is characterized by high thermal conductivity of >2.8 W/mK. Its use can reduce the temperature of the processor by up to 6 degrees, without replacing the heatsink. Operating temperature range -50°C to 250°C.
Availability: On order
AG Silver 0,5g thermally conductive paste for CPU, GPU etc.
AG Silver 0,5g - AG TermoPasty thermal paste, with silver compounds, intended for connections between the heat sink and the CPU, GPU, or other components. Also useful for connections between tubular condensers and heat exchangers inside solar collectors.
Availability: On order
AG Silver 1g thermal paste for CPU, GPU syringe
AG Silver 1g - (syringe) thermal paste from AG TermoPasty, with silver compounds, intended for connections between the heat sink and the CPU, GPU or other components. Also useful for connections between tubular condensers and exchangers inside solar collectors.
Availability: On order
AG Silver 3g thermal paste for CPU, GPU syringe
AG Silver 3g - (syringe) AG TermoPasty thermal conductive paste, with silver compounds, intended for connections between the heat sink and the CPU, GPU or other components. Also useful for connections between tubular condensers and exchangers inside solar collectors.
Availability: On order
AG Thermal conductive glue TermoGlue 10g- for mounting heat sinks
ThermoGlue Thermal conductive glue AG 10g - the glue is perfect for attaching heat sinks to e.g. memory cubes or transistors. It has good heat conduction properties. Do not exceed a layer thickness of 6mm. The complete drying time is approximately 24 hours.
Availability: Ask for availability and price
Loctite EA 9497 400 ml 2-part gray epoxy structural adhesive, high temperature resistant, medium viscosity, gap-filling, metal-specific
Two-component epoxy adhesive with high thermal resistance and thermal conductivity. The product sticks to metal parts very well
Availability: On order