


AG Silver 0,5g thermally conductive paste for CPU, GPU etc.
Description
AG Silver 0,5g - AG TermoPasty thermal paste, with silver compounds, intended for connections between the heat sink and the CPU, GPU, or other components. Also useful for connections between tubular condensers and heat exchangers inside solar collectors.
Producer |
AG TermoPasty |
Type |
Thermal paste |
Mass |
0.5g |
Thermal conductivity |
>3.8W/mK |
Usage |
Heat sinks CPU, GPU, RAM |