


Soldering paste 20g medium-active flux with a pasty consistency that facilitates soldering
Description
Solder paste
Soldering paste according to DIN EN 29454 5-1 1.1.2.C is a medium activity flux made of:
based on turpentine and an organic halogen activator, which facilitates the welding of copper, silver, zinc and nickel components . It is used for descaling and welding in engineering
radio and telecommunications and electrical equipment assembly. No flux residue after soldering
They corrode non-ferrous metals and may remain on welds. (It is recommended to wash with an alcohol
detergent).
The product is mainly used when rosin is not enough
Usage:
- tinning and soldering in radio technology and telecommunications
- assembly of electrical devices
- soldering of copper, silver, zinc and nickel-plated elements.
Physical and chemical properties
Parameters | Measurement unit |
Result |
Density at 80°C |
g/cm³ |
-1.1 |
Flash point |
°C |
> 150 |
Solubility |
- |
Insoluble in water |
Operating temperature |
°C |
>350 |
Appearance |
- |
paste, light brown |