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AG Copper 1.5 ml heat conductive paste, copper based, odorless, syringe
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On order
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Product code:
AGT-060
Description
AG Copper is a unique, odorless thermal conductive paste. Mainly based on copper, it benefits various cooling systems, especially when it comes to optimizing the processor-heatsink connection. This unique paste offers an effective solution that effectively increases cooling efficiency by improving heat conduction.
Properties:
- Scentless: The toothpaste has no scent, which makes it pleasant to use, especially in small, confined spaces.
- Copper-based: Copper-based ingredients make the paste an excellent thermal conductor, which helps keep the CPU at its optimum temperature.
- Effective Cooling: Helps improve CPU cooling by filling the CPU-heatsink junctions. This ensures better heat distribution, which translates into increased cooling efficiency.
- Safety: The paste is safe to use, does not conduct electricity, which minimizes the risk of component damage.
Usage:
- For CPU-heatsink connections for improved cooling.
- Cooling systems for both computers and laptops.
- Not suitable for aluminum heat sinks.
- Does not conduct electricity.
Technical data:
|
Product Specifications |
|
|---|---|
| Appearance |
paste, copper |
|
Smell |
smell free |
|
Melting point |
-50°C |
|
Flash point |
350°C |
|
Density |
2.9g/cm3 |
|
Scope of work |
-50 to 250°C |
|
Package |
1.5 ml (syringe) |
Storage method:
AG Copper Paste should be stored in a well-ventilated, cool and dry place, away from direct sunlight. When not in use, containers should be kept tightly closed and protected from sunlight to ensure its long-term effectiveness.
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