Silicone thermal paste HP, thermal conductivity paste 1.5 W/mK, silicone heat-conductive paste, HP cooling paste
Product code: AGT-127
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Product description
Pasta TermoPrzewodząca silicone HP is a flexible white paste that effectively conducts heat in electronic and electrical devices.
Advantages and unique features
- High thermal conductivity ≥ 1.5 W/mK
- Operating temperature range from −50 °C to 250 °C
- Non-electrically conductive – safe for sensitive electronics
- Resistant to moisture, oxidation, acids, bases, salts, SO₂ and ammonia
- Flexible, non-flowing consistency for easy application
Properties and applications
- Appearance: white paste, density ~ 2.1 g/cm³
- Thermal impedance: < 0.227 °C in²/W
- Evaporation: 0.001 %; bleeding: 0.05 %
- Applications: CPU/GPU cooling, LED modules, HDD/SSD, industrial electronics, HVAC, automotive control systems
Technical parameters
| Parameter | Value |
|---|---|
| Thermal conductivity | ≥ 1.5 W/mK |
| Density (20 °C) | ~ 2.1 g/cm³ |
| Operating temperature | −50 °C … 250 °C |
| Thermal impedance | < 0.227 °C in²/W |
| Evaporation | 0.001 % |
| Bleeding | 0.05 % |
| Thixotropic index | 380 ± 10 |
| Dielectric constant εr | 7.2 – 7.7 |
| Shelf life | 3 years |
Storage recommendations
Store in original, tightly sealed packaging in a dry, cool, well-ventilated place, and protect from direct sunlight.
Product safety
Manufacturer
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
Responsible person in the EU
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
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