


AG Thermal conductive glue TermoGlue 10g- for mounting heat sinks
Description
ThermoGlue Thermal conductive glue AG 10g - the glue is perfect for attaching heat sinks to e.g. memory cubes or transistors. It has good heat conduction properties. Do not exceed a layer thickness of 6mm. The drying time is approximately 24 hours.
Producer |
AG TermoPasty |
Type |
Thermal conductive glue |
Weight |
10 g |
Colour |
White |
Thermal conductivity |
W/mK >1,0 |
Drying |
2-8 minutes |
Max temp |
200°C |
Usage |
heat sinks attachment |