AG Thermal conductive glue TermoGlue 10g- for mounting heat sinks
Product code: AGT-116
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Product description
ThermoGlue Thermal conductive glue AG 10g - the glue is perfect for attaching heat sinks to e.g. memory cubes or transistors. It has good heat conduction properties. Do not exceed a layer thickness of 6mm. The drying time is approximately 24 hours.
|
Producer |
AG TermoPasty |
|
Type |
Thermal conductive glue |
|
Weight |
10 g |
|
Colour |
White |
|
Thermal conductivity |
W/mK >1,0 |
|
Drying |
2-8 minutes |
|
Max temp |
200°C |
|
Usage |
heat sinks attachment |
Product safety
Manufacturer
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
Responsible person in the EU
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
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