AG TermoGlue thermally conductive adhesive 120 g, white thermal paste for heat sinks and electronics, 1.0 W/mK

AG thermally conductive adhesive 120 g is a white, ready-to-use adhesive paste designed for mounting heat sinks and other heat-emitting components. It combines good thermal conductivity of 1.0 W/mK with high mechanical bond strength, providing durable and safe joints. The product is dielectric, so it transfers heat while electrically insulating the bonded parts.

Advantages and unique features

• Thermal conductivity 1.0 W/mK – efficient heat transfer from electronic components.
• Strong and durable adhesive bond, resistant to long-term operation.
• Dielectric – non-conductive, protects circuits against short-circuit.
• Maximum layer thickness up to 6 mm – bonding and gap filling in one step.
• Stable in a wide operating temperature range of approx. -50 °C to 200 °C.
• Ready-to-use homogeneous paste in a convenient 120 g pack.
• Compatible with most common materials used in electronics (heat sinks, PCBs, housings).

Properties and applications

• Heat sink mounting: ideal for bonding heat sinks to bridges, transistors, memory chips and other integrated circuits.
• Gap filling: allows simultaneous filling of gaps between heating elements while maintaining a continuous heat path.
• Service and repair: for repair and upgrade of electronic equipment where heat dissipation is required without mechanical fasteners.
• Safe for most materials: chemically safe for typical electronic substrates, reducing the risk of damage.
• Professional thermal management: suitable for assemblies that require both efficient heat transfer and mechanically stable fixing.

Technical parameters

Storage recommendations

After use, close the container tightly to prevent the paste from drying out. Store the thermally conductive adhesive in a cool, dry and well-ventilated place, away from heat sources and direct sunlight. Protect the product from frost and overheating and keep it out of reach of children.

FAQ

1) Which thermally conductive adhesive should I choose for a heat sink?
AG thermally conductive adhesive with a conductivity of 1.0 W/mK is suitable for typical heat sinks mounted on bridges, transistors and memory chips – it provides both heat transfer and secure fixing.

2) Does this thermal adhesive conduct electricity?
No, it has high dielectric strength – it transfers heat but electrically insulates, so it can be applied directly to electronic components.

3) What is the maximum layer thickness for TermoGlue?
According to the manufacturer’s recommendations, the maximum thickness of a single layer is 6 mm; thicker layers may increase the full curing time.

4) When does the bond reach full strength?
Typically the adhesive cures in about 24 hours, while at maximum layer thickness it may take up to 2 days to reach full strength.