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AG Gold 1g Thermal paste, syringe
Description
AG Golg 3g
Thermal conductive paste with gold content. It is characterized by high thermal conductivity of > 2.8 W/mK. Its use can reduce the temperature of the processor by up to 6 degrees, without replacing the heatsink. Operating temperature range -50°C to 250°C.
|
Manufacturer |
AG TermoPasty |
|
Type |
Thermal paste |
|
Weight |
1g |
|
Thermal conductivity |
2.8W/mK |
|
Application |
CPU, GPU, RAM heatsinks |
Warnings:< /span>
Loctite Henkel Premium Partner
Free delivery from 600 EURO to EU Countries*
+48 509 336 666


