AG Silver 3g thermal paste for CPU, GPU syringe
Product code: AGT-107
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Product description
AG Silver 3g - AG TermoPasty thermal conductive paste, with silver compounds, intended for connections between the heat sink and the CPU, GPU or other components. Also useful for connections between tubular condensers and exchangers inside solar collectors.
|
Manufacturer |
AG TermoPasty |
|
Type |
Thermal paste |
|
Weight |
3g |
|
Thermal conductivity |
>3.8W/mK |
|
Application |
CPU, GPU, RAM heatsinks |
|
Main ingredients |
silicone + silver |
Product safety
Manufacturer
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
Responsible person in the EU
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
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