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AG Silver 3g thermal paste for CPU, GPU syringe
Description
AG Silver 3g - AG TermoPasty thermal conductive paste, with silver compounds, intended for connections between the heat sink and the CPU, GPU or other components. Also useful for connections between tubular condensers and exchangers inside solar collectors.
|
Manufacturer |
AG TermoPasty |
|
Type |
Thermal paste |
|
Weight |
3g |
|
Thermal conductivity |
>3.8W/mK |
|
Application |
CPU, GPU, RAM heatsinks |
|
Main ingredients |
silicone + silver |
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Free delivery from 600 EURO to EU Countries*
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