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AG Silver 1g thermal paste for CPU, GPU syringe
Availability:
On order
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Product code:
AGT-164
Description
AG Silver thermal paste 1 g syringe is an advanced solution for heat dissipation from CPUs and GPUs, featuring >3.8 W/mK thermal conductivity.
Advantages and Unique Features
- Excellent thermal conductivity >3.8 W/mK
- Silver content for maximum efficiency
- Low thermal impedance <0.067 °C·in²/W
- Non-flowing – stable consistency across a wide temperature range
- RoHS compliant
Properties and Applications
- Thermal conductivity >3.8 W/mK: optimal CPU and GPU cooling.
- Operating temperature range: from −50 °C to 250 °C, suitable for extreme conditions.
- Thermal impedance <0.067 °C·in²/W: minimizes heat loss at the interface.
- Dielectric properties: 500 V/mm dielectric strength for safe insulation.
- Easy application: precise 1 g syringe prevents excess and simplifies dispensing.
Technical Parameters
| Parameter | Value |
|---|---|
| Appearance | silver paste |
| Density at 20 °C | 2.37 g/cm³ |
| Thermal conductivity | >3.8 W/mK |
| Operating temperature range | −50 °C to 250 °C |
| Thermal impedance | <0.067 °C·in²/W |
| Evaporation | <0.001 % |
| Viscosity | non-flowing |
| Thixotropic index | 380 ± 10 |
| Dielectric strength | 500 V/mm |
| Volume resistivity (ASTM D257) | 2.9 × 1011 Ω·m |
| Shelf life | 3 years |
Storage Recommendations
Store in a tightly closed syringe in a cool (5–25 °C), dry, well-ventilated place, away from sunlight. Keep out of reach of children.
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