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AG Silver 1g thermal paste for CPU, GPU syringe

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Price: €2.16 2.16
Net price: €1.75
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Description

AG Silver thermal paste 1 g syringe is an advanced solution for heat dissipation from CPUs and GPUs, featuring >3.8 W/mK thermal conductivity.

Advantages and Unique Features

  • Excellent thermal conductivity >3.8 W/mK
  • Silver content for maximum efficiency
  • Low thermal impedance <0.067 °C·in²/W
  • Non-flowing – stable consistency across a wide temperature range
  • RoHS compliant

Properties and Applications

  • Thermal conductivity >3.8 W/mK: optimal CPU and GPU cooling.
  • Operating temperature range: from −50 °C to 250 °C, suitable for extreme conditions.
  • Thermal impedance <0.067 °C·in²/W: minimizes heat loss at the interface.
  • Dielectric properties: 500 V/mm dielectric strength for safe insulation.
  • Easy application: precise 1 g syringe prevents excess and simplifies dispensing.

Technical Parameters

Parameter Value
Appearance silver paste
Density at 20 °C 2.37 g/cm³
Thermal conductivity >3.8 W/mK
Operating temperature range −50 °C to 250 °C
Thermal impedance <0.067 °C·in²/W
Evaporation <0.001 %
Viscosity non-flowing
Thixotropic index 380 ± 10
Dielectric strength 500 V/mm
Volume resistivity (ASTM D257) 2.9 × 1011 Ω·m
Shelf life 3 years

Storage Recommendations

Store in a tightly closed syringe in a cool (5–25 °C), dry, well-ventilated place, away from sunlight. Keep out of reach of children.

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