AG Golg 3 g Thermally conductive paste
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Product description
AG Golg 3g
Thermally conductive paste with gold content. It is characterized by high thermal conductivity of > 2.8 W / mK. Paste can l lower temperature of CPU even by 6°C, without replacement of radiator. Work temperature -50°C/250°C.
|
Producer |
AG TermoPasty |
|
Type |
Thermally conductive paste |
|
Mass |
3g |
|
Thermal conductivity |
2,8W/mK |
|
Usage |
CPU, GPU, RAM |
Product safety
Manufacturer
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
Responsible person in the EU
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
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