AG Silver 0,5g thermally conductive paste for CPU, GPU etc.
Product code: AGT-143
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Opis produktu
AG Silver 0,5g - AG TermoPasty thermal paste, with silver compounds, intended for connections between the heat sink and the CPU, GPU, or other components. Also useful for connections between tubular condensers and heat exchangers inside solar collectors.
|
Producer |
AG TermoPasty |
|
Type |
Thermal paste |
|
Mass |
0.5g |
|
Thermal conductivity |
>3.8W/mK |
|
Usage |
Heat sinks CPU, GPU, RAM |
Product safety
Manufacturer
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
Responsible person in the EU
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
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