Termopasty Copper 4 g thermal paste with copper
Product code: AGT-060
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Product description
Termopasty Copper 4 g thermal paste with copper for copper heatsinks
Termopasty Copper 4 g is a thermal paste with copper compounds, designed to improve heat transfer between an electronic component and a copper heatsink. The product fills microscopic surface irregularities between contact surfaces, reducing thermal resistance and supporting stable operation of the cooled component.
The 4 g syringe is the current manufacturer variant for article number ART.AGT-060. This format makes it easier to apply a precise amount of paste onto a processor, power module or another component requiring effective thermal contact with a heatsink.
Applications of Copper 4 g thermal paste
Termopasty Copper 4 g is intended for cooling systems in computers and industrial devices, as well as for components requiring resistance to high temperatures. The manufacturer indicates applications including processors, power modules, converters, motor controllers and power amplifiers.
The paste is designed for use with copper heatsinks. Thanks to the content of copper compounds, it supports heat transfer from the electronic component to the cooling system, which is important for components operating under thermal load.
What distinguishes Termopasty Copper 4 g
The key feature of this product is its thermal conductivity of approx. 3.1 W/mK and a formula containing copper compounds. The paste has dielectric properties, does not evaporate and, according to the technical data, does not flow, helping maintain a stable layer between the component and the heatsink.
The product works in a wide temperature range from -50°C to 250°C. This makes it suitable for applications where thermal stability and reduction of losses caused by insufficient contact between surfaces are important.
When to choose Copper thermal paste
This product is worth choosing when the cooled component works with a copper heatsink and a thermal paste with increased thermal conductivity is required. It is suitable for computer assembly and servicing, power electronics and devices where efficient heat transfer is important.
This paste is not recommended for aluminium heatsinks. The manufacturer states that using Copper paste with aluminium is not recommended, as it may lead to galvanic corrosion. For aluminium heatsinks, a different thermal paste from the manufacturer’s range should be selected.
How to use Termopasty Copper 4 g
Before use, the surfaces should be clean and dry. Apply a thin, even layer of paste, avoiding excess, as too much material may reduce heat transfer efficiency. Then install the heatsink or other cooling element according to the device manufacturer’s instructions.
The product is intended for professional users. Before use, read the safety data sheet and use the paste according to its intended purpose.
Technical data of Termopasty Copper 4 g
| Parameter | Value |
|---|---|
| Manufacturer | AG TermoPasty |
| Product name | Copper |
| Article number | ART.AGT-060 |
| EAN code | 5901764329992 |
| Net content | 4 g |
| Packaging type | Syringe |
| Quantity in collective packaging | 5 pcs. |
| Product type | Thermal paste with copper compounds |
| Application | Copper heatsinks, processors, power modules and electronic components |
| Appearance | Copper-coloured paste |
| Density at 20°C | 2.9 g/cm³ |
| Thermal conductivity | approx. 3.1 W/mK |
| Operating temperature range | from -50°C to 250°C |
| Freezing point | -50°C |
| Flash point | 350°C |
| Evaporation | Does not evaporate |
| Viscosity | Does not flow |
| Volume resistivity | 3.8 × 10¹⁴ Ω × cm |
| Dielectric loss factor tg δ | 0.013 at 120 Hz |
| Relative dielectric permittivity εr | 13.6 at 120 Hz |
| Thixotropic index | 380 ± 10 |
| Shelf life | 3 years |
| Compliance | RoHS |
| Use limitation | Not recommended for aluminium heatsinks |
| CLP classification | Acute Tox. 4 H302, Eye Irrit. 2 H319, STOT SE 3 H335, Aquatic Chronic 3 H412 |
| CLP signal word | Warning |
Storage
Store in a cool, dry and well-ventilated place. Keep the packaging tightly closed when the product is not in use. Protect from direct sunlight.
FAQ
Is Termopasty Copper 4 g the current content for AGT-060?
Yes. The current manufacturer variant for ART.AGT-060 is a 4 g syringe. Older descriptions may still indicate 1.5 ml, so the current 4 g content should be used in the product name and description.
What is Copper thermal paste used for?
The paste is used to improve heat transfer between an electronic component and a copper heatsink. It fills microscopic surface irregularities and reduces thermal resistance.
Can Termopasty Copper be used with aluminium heatsinks?
The manufacturer does not recommend using Copper paste with aluminium heatsinks, as it may cause galvanic corrosion. A different thermal paste should be selected for aluminium.
What is the thermal conductivity of Termopasty Copper?
The thermal conductivity of the paste is approx. 3.1 W/mK.
Does Copper paste have dielectric properties?
Yes. The manufacturer indicates dielectric properties, including volume resistivity of 3.8 × 10¹⁴ Ω × cm.
How should Copper thermal paste be applied?
Apply a thin, even layer onto a clean and dry surface. Excess paste may reduce heat transfer efficiency, so it should not be applied in too large an amount.
What is the operating temperature range of Termopasty Copper?
The operating temperature range is from -50°C to 250°C.
Product safety
Manufacturer
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
Responsible person in the EU
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
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