Search
Producers
Login
AG Silver 0,5g thermally conductive paste for CPU, GPU etc.
Description
AG Silver 0,5g - AG TermoPasty thermal paste, with silver compounds, intended for connections between the heat sink and the CPU, GPU, or other components. Also useful for connections between tubular condensers and heat exchangers inside solar collectors.
|
Producer |
AG TermoPasty |
|
Type |
Thermal paste |
|
Mass |
0.5g |
|
Thermal conductivity |
>3.8W/mK |
|
Usage |
Heat sinks CPU, GPU, RAM |
Loctite Henkel Premium Partner
Free delivery from 600 EURO to EU Countries*
+48 509 336 666


