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Easy Print Sn62Pb36Ag2 20 g solder paste, No Clean, Fine Pitch, Mid Chip Solderballing resistant

Availability: Available 4-10 pcs
Delivery: The price does not include any possible payment costs check the delivery methods
Price: €15.10 15.10
Net price: €12.27
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Description

Discounted product – Expiry date: 4/10/2025

Easy Print /Sn62Pb36Ag2/ 20 g solder paste is a premium No Clean paste for SMD applications. The Sn62Pb36Ag2 alloy ensures excellent wetting and reliable joints.

Advantages and Unique Features

  • Sn62 % / Pb36 % / Ag2 % composition for optimal wetting
  • Fine Pitch – superior detail fidelity
  • Mid Chip Solderballing resistance
  • Component adhesion > 24 h
  • No Clean – no washing required

Properties and Applications

  • Stencil printing speed up to 150 mm/s: fast paste application
  • Reflow soldering: in air or nitrogen, melting point 179 °C
  • Laser-cut and electroformed stencils: recommended aperture thickness 100–150 μm
  • Cl paper chromatography test: IPC TM 650 compliant (REL 0)

Technical Specifications

Parameter Value
Alloy composition Sn62 % / Pb36 % / Ag2 %
Density ~ 4.6 g/cm³
Particle size 15–25 μm (20 g), 25–45 μm (others)
Viscosity 1.0 G/mm² after 24 h
Print life ≥ 8 h
Melting point 179 °C
Peak temperature 210–220 °C
Shelf life 6 months

Storage Recommendations

Store at 3–7 °C in a sealed syringe for up to 6 months. Allow to reach room temperature before use.

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