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Easy Print Sn62Pb36Ag2 20 g solder paste, No Clean, Fine Pitch, Mid Chip Solderballing resistant

Pasta lutownicza Easy Print Sn62Pb36Ag2 20 g

Availability: Available 4-10 pcs

Delivery: The price does not include any possible payment costs check the delivery methods

Price: €15.10 15.10

Net price: €12.27

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Product code: AGT-024

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Description

Discounted product – Expiry date: 4/10/2025

Easy Print /Sn62Pb36Ag2/ 20 g solder paste is a premium No Clean paste for SMD applications. The Sn62Pb36Ag2 alloy ensures excellent wetting and reliable joints.

Advantages and Unique Features

Sn62 % / Pb36 % / Ag2 % composition for optimal wetting
Fine Pitch – superior detail fidelity
Mid Chip Solderballing resistance
Component adhesion > 24 h
No Clean – no washing required

Properties and Applications

Stencil printing speed up to 150 mm/s: fast paste application
Reflow soldering: in air or nitrogen, melting point 179 °C
Laser-cut and electroformed stencils: recommended aperture thickness 100–150 μm
Cl paper chromatography test: IPC TM 650 compliant (REL 0)

Technical Specifications

Parameter	Value
Alloy composition	Sn62 % / Pb36 % / Ag2 %
Density	~ 4.6 g/cm³
Particle size	15–25 μm (20 g), 25–45 μm (others)
Viscosity	1.0 G/mm² after 24 h
Print life	≥ 8 h
Melting point	179 °C
Peak temperature	210–220 °C
Shelf life	6 months

Storage Recommendations

Store at 3–7 °C in a sealed syringe for up to 6 months. Allow to reach room temperature before use.