AG TermoPasty Easy Print Sn62Pb36Ag2 20 g – No-Clean solder paste for SMD

WARNING: This product contains lead. It is sold exclusively to businesses and professional users. The product is not intended for sale to consumers. Purchase is only possible using company details.

AG TermoPasty Easy Print Sn62Pb36Ag2 20 g is a solder paste designed for professional leaded soldering of SMD components. The alloy containing 62% tin, 36% lead and 2% silver enables durable and reliable solder joints in electronics manufacturing and repair applications.

The paste is suitable for reflow soldering in both normal atmospheric and nitrogen environments. It can be applied using a suitable dispenser or cartridge and by stencil printing with laser-cut or electroformed stencils.

Key features

• Sn62Pb36Ag2 alloy composition: 62% tin, 36% lead and 2% silver,
• No-Clean formula – normally eliminates the need for cleaning after soldering,
• designed for soldering SMD components,
• high Fine-Pitch detail reproduction,
• resistance to Mid Chip Solderballing,
• printability maintained for more than 8 hours,
• component tack maintained for more than 24 hours,
• suitable for reflow soldering in normal atmosphere and nitrogen,
• complies with ISO 9454 1223 and J-STD-004 REM-1 requirements.

Applications

• soldering SMD components,
• assembly and repair of printed circuit boards,
• reflow soldering,
• stencil printing,
• professional electronics manufacturing,
• service and repair of electronic devices.

Technical data

Directions for use

Before application, allow the paste to reach room temperature to prevent moisture condensation. Do not open the container while it is still cold and do not mix used paste with fresh paste.

The optimum application temperature is 23–26°C, with a maximum recommended application temperature of 28°C. Apply the paste to the soldered components using a suitable dispenser or stencil.

Laser-cut or electroformed stencils and metal squeegees are recommended for stencil printing. The recommended squeegee speed is 25–150 mm/s.

Cleaning after soldering

Easy Print is a No-Clean solder paste, which means that its residues normally do not need to be removed. Where process requirements make cleaning necessary, use a suitable alcohol-based PCB cleaner.

Safety information

The product contains lead and is intended exclusively for professional use. Read the current safety data sheet before use. Wear suitable protective gloves, protective clothing and eye or face protection. Avoid breathing fumes, dust and vapours generated during use and ensure effective workplace ventilation.

Storage

Store at a temperature of 3–7°C in a tightly closed container for no longer than 6 months. Protect against contamination. Before opening, allow the paste to reach room temperature to prevent moisture condensation.

Frequently asked questions

What is Easy Print Sn62Pb36Ag2 solder paste used for?

The paste is intended for professional soldering of SMD components, assembly and repair of printed circuit boards, and Reflow soldering processes.

Is Easy Print Sn62Pb36Ag2 lead-free?

No. The Sn62Pb36Ag2 alloy contains 62% tin, 36% lead and 2% silver. For this reason, the product is intended exclusively for businesses and professional users.

Does the paste require cleaning after soldering?

Easy Print is a No-Clean solder paste, so residues normally do not need to be removed after soldering. Where the manufacturing process requires cleaning, a suitable PCB cleaner should be used.

Is the paste suitable for Fine-Pitch components?

Yes. The paste is designed for precise application and soldering of SMD components, including assemblies requiring accurate reproduction of Fine-Pitch pads and tracks.

What is the particle size of the 20 g package?

For the 20 g package, the manufacturer specifies a particle size of 15–25 µm.

How should Easy Print Sn62Pb36Ag2 be stored?

Store the paste at 3–7°C in a tightly closed container for no longer than 6 months. Before opening, allow the product to reach room temperature to prevent moisture condensation.