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Easy Print Sn96.5Ag3Cu0.5 solder paste

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Price: €4.42 4.42
Net price: €3.59
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Vendor: Termopasty
Product code: ART.AGT-028


Easy Print Sn96.5Ag3Cu0.5 soldering paste - soldering paste designed for precise SMD soldering. Does not require washing, residues do not cause corrosion. Works with all lead-free alloys. Improves solder adhesion. It does not lose its properties even after leaving it for 20 hours on the PCB.


- Resistant to shot peening (mid chip solderballing)

- Good adhesion even 24 hours after application

- The paste has a high fidelity in reproducing details

- Printing capabilities with a squeegee speed of up to 150 mm / s

-The paste faithfully reproduces the contours for up to 8 hours of continuous printing


- Laser cut or electroformed stencils: 100 μm for rasta = 0.4 mm 150 μm for rasta > 0.5 mm

-Recommended metal squeegees • squeegee speed in the printer: 25- 150 mm/sec

-Squeegee pressure: 1.5- 3N per cm of length

-Amount of paste on the template: a 15-20 mm thick roller rolling in front of the squeegee

Reflow soldering:

-All brazing methods are possible (in normal atmosphere and in nitrogen) -

preheating: constant increase 1-2.0ºC/s up to 145-160ºC or max. 210-220ºC for the version without plateu

- Plateau slurry (only for packages with a high density of elements of different weight) 145-160ºC for 60-90 s

- Soldering - reflow phase: 30-90 s above 180ºC

- Cooling: gradient: 1-2ºC/s

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