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Flux Gel 60g - No-Clean Flux Gel for soldering precise soldering activator, excellent wettability, high adhesion, no need to wash off, flux for electronics
Description
Flux Gel 60g is a specialized, no-clean flux gel designed for SMD and SMT soldering, providing excellent wettability and clean joints without the need for post-solder cleaning.
Advantages and Unique Features
- Concentrated rosin-based RMA flux formula
- No-Clean technology – no cleaning required after soldering
- High wettability and adhesion on Ag, Au, Cu, Zn, Cd, SnPb surfaces
- Printable up to 36 hours, tackiness preserved up to 72 hours
- Meets ISO 9454-1 and J-STD-004 (ROMO) standards
Properties and Applications
- Concentrated RMA flux: precise soldering of SMD/SMT components
- No-Clean: no residue removal needed after soldering
- Material compatibility: safe for copper, silver, gold, zinc, cadmium, and tin-lead alloys
- Convenient application: large 60g syringe ideal for efficient gel dispensing
- Flux gel: minimizes spillage and ensures even distribution
Technical Parameters
| Parameter | Value |
|---|---|
| Appearance | Amber paste |
| Density at 80 °C | ~1 g/cm³ |
| Flash Point | > 150 °C |
| Water Solubility | Insoluble |
| Shelf Life | 3 years |
Storage Recommendations
Store in a cool, dry, well-ventilated place; after use, close the container tightly to preserve full flux performance.
Loctite Henkel Premium Partner
Free delivery from 600 EURO to EU Countries*
+48 509 336 666


