Flux Gel 60g - No-Clean Flux Gel for soldering precise soldering activator, excellent wettability, high adhesion, no need to wash off, flux for electronics
Product code: AGT-089
Leave feedback on the product
Shipping cost for the selected product
The shipping cost applies to this product (in the selected variant - if applicable). It may change after adding other products to the cart.
Related products
Secure purchase guarantee
Product description
Flux Gel 60g is a specialized, no-clean flux gel designed for SMD and SMT soldering, providing excellent wettability and clean joints without the need for post-solder cleaning.
Advantages and Unique Features
- Concentrated rosin-based RMA flux formula
- No-Clean technology – no cleaning required after soldering
- High wettability and adhesion on Ag, Au, Cu, Zn, Cd, SnPb surfaces
- Printable up to 36 hours, tackiness preserved up to 72 hours
- Meets ISO 9454-1 and J-STD-004 (ROMO) standards
Properties and Applications
- Concentrated RMA flux: precise soldering of SMD/SMT components
- No-Clean: no residue removal needed after soldering
- Material compatibility: safe for copper, silver, gold, zinc, cadmium, and tin-lead alloys
- Convenient application: large 60g syringe ideal for efficient gel dispensing
- Flux gel: minimizes spillage and ensures even distribution
Technical Parameters
| Parameter | Value |
|---|---|
| Appearance | Amber paste |
| Density at 80 °C | ~1 g/cm³ |
| Flash Point | > 150 °C |
| Water Solubility | Insoluble |
| Shelf Life | 3 years |
Storage Recommendations
Store in a cool, dry, well-ventilated place; after use, close the container tightly to preserve full flux performance.
Product safety
Manufacturer
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
Responsible person in the EU
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
Reviews
If you've added a review and it doesn't appear on the list, it may be pending moderation.
Leave feedback on the product
Log in with Google
