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Gel flux in syringe 1.5 g for SMD soldering and SMT repairs
Description
Gel flux in syringe 1.5 g for SMD soldering and SMT repairs
Gel flux in syringe 1.5 g is a thickened rosin-based RMA flux designed for precise SMD soldering, SMT assembly and PCB repair. Its gel consistency makes it easier to apply the flux exactly where it is needed and helps prevent uncontrolled spreading outside the soldering area.
The product uses a No Clean formula, which means that according to the manufacturer, residues do not normally need to be removed after soldering, unless a specific process requires PCB cleaning. This makes it a practical choice for electronics service, prototyping, rework and precise repair work.
Application
This gel flux is intended for SMD soldering, SMT assembly and repair, PCB rework and precise soldering of electronic components. It is useful wherever a liquid flux would be harder to control or could spread too easily across the board.
According to the manufacturer, the product provides good solderability on surfaces such as silver, copper, gold, zinc, cadmium and SnPb. This makes it suitable for typical service and assembly tasks in electronics.
What makes this gel flux different
The key advantage of this 1.5 g version is the combination of a No Clean formula, RMA class and convenient syringe packaging for precise dosing. The gel form helps apply a small amount of flux exactly to pads, component leads and repair points.
The manufacturer declares compliance with ISO 9454 1134 and J-STD-004 ROM0. This is important for users who need a defined flux for controlled electronics work, not just a generic soldering aid.
When to choose flux in a syringe
This product is a good choice when you need a flux for precise PCB repair, SMD soldering, SMT assembly or rework. The 1.5 g package is practical for service work, occasional repairs, prototyping and applications where accurate dosing is more important than large volume.
For repeated high-volume use, a larger flux package may be more convenient. For small, precise soldering jobs, however, the syringe format helps reduce waste and gives better control over application.
What to check before use
Before use, read the safety data sheet and follow safe handling rules for chemical products used in electronics. The soldering area should be clean, and the amount of flux should be adjusted to the size of the working area.
No Clean flux usually does not require cleaning after soldering, but if a specific PCB cleanliness procedure is required in your process, follow the internal process requirements.
How to use gel flux in syringe
Apply a small amount of flux directly to the soldering area. Then solder using a method, temperature and soldering material suitable for the component and PCB. For small SMD parts, it is better to start with a minimal amount of flux and add more only if needed.
After use, close the package to limit air exposure and contamination. In professional applications, use the product according to the process procedure used at the workstation.
Technical data
| Parameter | Value |
|---|---|
| Manufacturer | AG TermoPasty |
| Product name | Flux Gel |
| Melkib code | AGT-047 |
| Manufacturer article number | ART.AGT-047 |
| EAN | 5901764329435 |
| Net weight | 1.5 g |
| Product type | Gel flux for soldering |
| Base / class | Thickened rosin-based RMA flux |
| Formula | No Clean |
| Flux type | Halide-free, RMA, ROM0 |
| Form | Gel |
| Colour | Amber |
| Packaging | Syringe |
| Application | SMD soldering, SMT assembly and repair, PCB repair |
| Surfaces according to the manufacturer | Ag, Cu, Au, Zn, Cd, SnPb |
| Density | Approx. 1.0 g/cm³ at 80°C |
| Flash point | >150°C |
| Compliance according to the manufacturer | ISO 9454 1134, J-STD-004 ROM0 |
| CLP signal word | Danger |
| Selected H statements | H315, H317, H318, H334 |
| Transport | Not subject to transport regulations |
Storage
Store in a tightly closed container in a cool, dry and well-ventilated place. Protect from ignition sources, overheating, frost and accidental contamination. Close the packaging after use. ?
FAQ
Does this gel flux need to be cleaned after soldering?
The manufacturer defines this product as No Clean, so residues normally do not need to be removed after soldering. If your process requires PCB cleaning, follow the procedure used in your workplace.
Is this flux suitable for SMD soldering?
Yes. The gel flux is intended for SMD soldering, SMT assembly and repair.
Is gel flux better than liquid flux for PCB repair?
For precise PCB repair, gel flux is often more convenient because it stays where it is applied. Liquid flux can be useful in other tasks, but gel gives more application control during point soldering.
Which surfaces is this flux suitable for?
According to the manufacturer, the product provides good solderability on Ag, Cu, Au, Zn, Cd and SnPb surfaces.
Are AGT-047 and ART.AGT-047 the same product?
Yes. AGT-047 is a short trade code, while ART.AGT-047 is the manufacturer’s article number. Both refer to the same 1.5 g gel flux in this product card.
Is the 1.5 g package enough for service work?
Yes. For point repairs and SMD soldering, this amount is practical because the product is applied locally in small portions.
Gel flux in syringe 1.5 g is a practical choice for precise SMD soldering, SMT repairs and service work on PCB assemblies. ?
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