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Gel flux in cartridge 11 g for SMD soldering and SMT repairs
Description
Gel flux in cartridge 11 g for SMD soldering and SMT repairs
Gel flux in cartridge 11 g is a thickened RMA rosin flux designed for soldering SMD components as well as SMT assembly and repair. Its gel form supports controlled application, reduces spreading and helps keep the flux exactly where it is needed.
This version is larger than the small 1.5 g syringe, but still convenient for electronics service, PCB repair, workshop use and precision soldering. The 11 g cartridge is a practical choice when flux is used more often and the user needs a handy package without moving straight to large production-size containers.
Application of gel flux 11 g
The gel flux is intended for SMT assembly and repair, SMD soldering and precision work on electronic components. According to the manufacturer, it can be used on Ag, Cu, Au, Zn, Cd and SnPb surfaces.
In practice, the product is suitable for PCB repairs, soldering corrections, electronics servicing, prototyping and applications where a liquid flux would be harder to keep in one place.
What makes gel flux in cartridge 11 g stand out
The key feature of this product is the combination of RMA class, gel consistency and No Clean technology. The flux is designed to support good solderability on typical surfaces used in electronics, while its amber paste does not require cleaning after soldering if the technological process does not require it.
The gel formula helps reduce flux spreading and supports even distribution. This is important when working with small components, PCB pads and areas where excess flux could make soldering more difficult to control.
When to choose the 11 g cartridge
The 11 g cartridge is a good choice when a small syringe is not enough for regular work, but a large 60 g or 1 kg package would be unnecessary. It is a practical format for service departments, electronics workshops, maintenance teams with electronics support and users who regularly perform soldering repairs and rework.
If the flux is used only occasionally, a smaller 1.5 g syringe may be more convenient. For high and repeatable consumption, larger packages from the same product line may be worth considering.
What to check before use
The product is intended for professional use only. Before use, read the safety data sheet and use appropriate personal protective equipment. The soldering surface should be clean, and the amount of flux should be adjusted to the size of the working area.
The flux is made in No Clean technology, but in processes with specific PCB cleanliness requirements, the user should follow the procedure defined for the workstation.
How to use gel flux in cartridge
Before use, make sure the surface is clean. Apply a small amount of gel flux to the soldering area using the cartridge or another suitable application method. Then carry out soldering with a temperature and technique suitable for the component, PCB and solder alloy.
After use, close the package to reduce contact with air and contamination. Do not use the product in a way other than intended by the manufacturer.
Technical data of gel flux 11 g
| Parameter | Value |
|---|---|
| Manufacturer | AG TermoPasty |
| Product name | Topnik żel / Flux Gel |
| Melkib code | AGT-179 |
| Manufacturer article number | ART.AGT-179 |
| EAN | 5901764327721 |
| Net weight | 11 g |
| Package type | Cartridge |
| Quantity in outer packaging | 8 pcs |
| Product type | Gel flux for soldering |
| Base / class | Thickened RMA rosin flux |
| Formula | No Clean |
| Form | Paste / gel |
| Colour | Amber |
| Density according to TDS | Approx. 1 g/cm³ at 80°C |
| Density according to SDS | Approx. 1.1 g/cm³ at 80°C |
| Flash point | >150°C |
| Solubility in water | Insoluble |
| Shelf life | 3 years |
| Printability | 36 hours |
| Tack retention | Up to 72 hours |
| Application | SMT assembly and repair, soldering of Ag, Cu, Au, Zn, Cd and SnPb surfaces, soldering of precision electronic components |
| Application methods according to TDS | Cartridge, syringe, screen, stencil, reflow soldering |
| Manufacturer-declared compliance | ISO 9454 1134, J-STD-004 ROM0 |
| UFI | TH00-003M-T001-TPRP |
| CLP signal word | Danger |
| Selected H statements | H315, H317, H318, H334 |
| Transport | Not subject to transport regulations |
Storage
Store in a cool, dry and well-ventilated place. Keep the container tightly closed when not in use. Protect from flames, sparks, overheating, frost, strong acids, alkalis and oxidising substances.
FAQ
Does gel flux 11 g need to be cleaned after soldering?
The manufacturer defines this product as No Clean, which means that cleaning after soldering is not required in a typical process. If PCB cleaning or residue control is required in a given process, follow the procedure used at the workstation.
Is this flux suitable for SMD soldering?
Yes. The product is intended for SMD soldering as well as SMT assembly and repair. Its gel consistency supports precise application and helps reduce spreading.
What is the difference between the 11 g cartridge and the small 1.5 g syringe?
The 11 g cartridge contains more flux and is better suited for regular service or workshop use. The small 1.5 g syringe is more convenient for occasional and very small repairs.
Which surfaces can this flux be used on?
According to the manufacturer, the product can be used for soldering Ag, Cu, Au, Zn, Cd and SnPb surfaces.
Can gel flux in cartridge be used for PCB repairs?
Yes. The product is suitable for precision soldering work in electronics, including PCB repairs, rework and SMD component assembly.
Do AGT-179 and ART.AGT-179 refer to the same product?
Yes. AGT-179 is the shortened commercial code, while ART.AGT-179 is the manufacturer article number for the 11 g gel flux cartridge.
Gel flux in cartridge 11 g is a practical format for regular SMD, SMT and electronics repair soldering work.
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