Flux RF800 1 L, No Clean flux, medium active rosin solution for SMD soldering, mixed assembly, consumer electronics, excellent copper wettability, fast acting
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Product description
Topnik RF800 1 L is a reliable No Clean rosin-based flux, ideal for precise soldering of SMD components and mixed assembly in professional electronics. Thanks to its high efficiency and excellent surface wetting, it ensures clean and durable joints with no post-soldering cleaning required.
Advantages and unique features
- No Clean – no need to clean after soldering
- High effectiveness even on challenging surfaces
- Compliant with J-STD-004 ROL0 standard
- Medium-activity formulation minimizes corrosion risk
- Ready-to-use – convenient 1 L bottle
- Safe for most electronic materials
Properties and applications
- SMD component soldering: provides precise solder joints in demanding applications
- Wire tinning: facilitates wire end preparation for further assembly
- Mixed assembly: suitable for both professional and consumer electronics
- Wetting of Cu and PbSn surfaces: improves adhesion and connection quality
- Fast action: speeds up the soldering process without compromising quality
Technical parameters
| Parameter | Value |
|---|---|
| Appearance | Amber liquid |
| Density at 20°C | 0.80 g/cm³ |
| Viscosity at 20°C | 15.8 cP |
| Acid number | 18.5 mg KOH/g |
| pH (5% aqueous solution) | 3.4 |
| Solubility in water | Soluble |
| Boiling point | 82°C |
| Autoignition temperature | 425°C |
| Flash point | 12°C (closed cup) |
| Solids content | 4% |
| Shelf life | 3 years |
Storage recommendations
Store the product at 5–30°C in its original, tightly closed container in a dry, cool, and well-ventilated area, away from heat sources, oxidizing agents, and direct sunlight. Keep away from food and beverages. Reseal opened containers tightly and store upright to prevent leakage.
Product safety
Manufacturer
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
Responsible person in the EU
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
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