AG Thermopad 20x130x1.0, 2.4 W/mK, thermal pad, flexible heat conductor, self-adhesive thermal interface material
Product code: AGT-137
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Product description
AG Thermopad 20x130x1.0 2.4 W/mK is a flexible thermal pad that delivers effective heat dissipation and secure mounting of electronic components.
Advantages and Unique Features
- High thermal conductivity of 2.4 W/mK
- Flexible structure adapts to surface irregularities
- Double-sided adhesive layer for easy installation
- Temperature resistance from –60 °C to 200 °C
- No need for additional fastening materials
Properties and Applications
- Thermal Conductivity: 2.4 W/mK – efficient heat transfer from circuits
- Density: 2.9 g/cm³ – stable component support
- Hardness (Shore A): 30 – maintains flexibility under high pressure
- Operating Temperature Range: –60 °C to 200 °C – suitable for various conditions
- Resistivity: 1×10¹¹ Ω/m – dielectric properties
Technical Specifications
| Parameter | Value |
|---|---|
| Dimensions | 20 × 130 × 1.0 mm |
| Thermal Conductivity | 2.4 W/mK |
| Density | 2.9 g/cm³ |
| Hardness (Shore A) | 30 |
| Temperature Range | –60 °C – 200 °C |
| Resistivity | 1×10¹¹ Ω/m |
Storage Recommendations
Store in a dry place, protect from direct sunlight, and avoid moisture and contaminants.
Product safety
Manufacturer
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
Responsible person in the EU
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
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