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AG Thermopad 20x130x1.0, 2.4 W/mK, thermal pad, flexible heat conductor, self-adhesive thermal interface material

Availability: On order

Delivery: The price does not include any possible payment costs check the delivery methods

Price: €2.83 2.83

Net price: €2.30

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Product code: AGT-137

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Description

AG Thermopad 20x130x1.0 2.4 W/mK is a flexible thermal pad that delivers effective heat dissipation and secure mounting of electronic components.

Advantages and Unique Features

High thermal conductivity of 2.4 W/mK
Flexible structure adapts to surface irregularities
Double-sided adhesive layer for easy installation
Temperature resistance from –60 °C to 200 °C
No need for additional fastening materials

Properties and Applications

Thermal Conductivity: 2.4 W/mK – efficient heat transfer from circuits
Density: 2.9 g/cm³ – stable component support
Hardness (Shore A): 30 – maintains flexibility under high pressure
Operating Temperature Range: –60 °C to 200 °C – suitable for various conditions
Resistivity: 1×10¹¹ Ω/m – dielectric properties

Technical Specifications

Parameter	Value
Dimensions	20 × 130 × 1.0 mm
Thermal Conductivity	2.4 W/mK
Density	2.9 g/cm³
Hardness (Shore A)	30
Temperature Range	–60 °C – 200 °C
Resistivity	1×10¹¹ Ω/m

Storage Recommendations

Store in a dry place, protect from direct sunlight, and avoid moisture and contaminants.