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AG Thermopad 20x130x2.0 mm 1.5 W/mK – thermal pad with adhesive for heatsinks and electronic modules

Availability: Available 4-10 pcs
Delivery: The price does not include any possible payment costs check the delivery methods
Price: €3.66 3.66
Net price: €2.98
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Description

AG Thermopad 20x130x2.0 mm (1.5 W/mK) is a flexible thermal pad with double-sided adhesive, designed for effective heat dissipation in electronic and industrial components.

Advantages and unique features

  • Consistent thermal conductivity: 1.5 W/mK
  • Double-sided adhesive layer for easy application
  • Elongated format – ideal for heatsinks and linear modules
  • Wide operating temperature: –60 °C to 200 °C
  • Easy to cut and shape for specific applications

Properties and applications

  • Applications: computers, LED systems, power supplies, industrial cooling modules
  • Material: thermal pad with 1.5 W/mK conductivity, adhesive on both sides
  • Electrical properties: volume resistivity 1×10¹¹ Ω/m, dielectric constant 5 (1 kHz)
  • Format: 20 × 130 mm strip, 2.0 mm thick, ready to use

Technical parameters

Parameter Value
Dimensions 20 × 130 × 2.0 mm
Thermal conductivity 1.5 W/mK
Density at 20 °C 2 g/cm³
Hardness (Shore A) 40
Operating temperature –60 °C to 200 °C
Volume resistivity 1×10¹¹ Ω/m
Dielectric constant 5 (1 kHz)
Adhesive layer Double-sided
Shelf life 3 years

Storage recommendations

Store in a dry place, away from heat sources and direct sunlight. Keep in the original sealed packaging.

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