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AG Thermopad 20x130x2.0 mm 1.5 W/mK – thermal pad with adhesive for heatsinks and electronic modules
Description
AG Thermopad 20x130x2.0 mm (1.5 W/mK) is a flexible thermal pad with double-sided adhesive, designed for effective heat dissipation in electronic and industrial components.
Advantages and unique features
- Consistent thermal conductivity: 1.5 W/mK
- Double-sided adhesive layer for easy application
- Elongated format – ideal for heatsinks and linear modules
- Wide operating temperature: –60 °C to 200 °C
- Easy to cut and shape for specific applications
Properties and applications
- Applications: computers, LED systems, power supplies, industrial cooling modules
- Material: thermal pad with 1.5 W/mK conductivity, adhesive on both sides
- Electrical properties: volume resistivity 1×10¹¹ Ω/m, dielectric constant 5 (1 kHz)
- Format: 20 × 130 mm strip, 2.0 mm thick, ready to use
Technical parameters
| Parameter | Value |
|---|---|
| Dimensions | 20 × 130 × 2.0 mm |
| Thermal conductivity | 1.5 W/mK |
| Density at 20 °C | 2 g/cm³ |
| Hardness (Shore A) | 40 |
| Operating temperature | –60 °C to 200 °C |
| Volume resistivity | 1×10¹¹ Ω/m |
| Dielectric constant | 5 (1 kHz) |
| Adhesive layer | Double-sided |
| Shelf life | 3 years |
Storage recommendations
Store in a dry place, away from heat sources and direct sunlight. Keep in the original sealed packaging.
Loctite Henkel Premium Partner
Free delivery from 600 EURO to EU Countries*
+48 509 336 666


