AG Thermopad 20x130x3.0 mm 2.4 W/mK – thermal pad with adhesive for LED and power electronics
Product code: AGT-139
Leave feedback on the product
Shipping cost for the selected product
The shipping cost applies to this product (in the selected variant - if applicable). It may change after adding other products to the cart.
Related products
Secure purchase guarantee
Product description
AG Thermopad 20x130x3.0 mm (2.4 W/mK) is a flexible thermal interface pad with double-sided adhesive, designed for efficient heat dissipation across elongated components in electronic and industrial applications.
Advantages and unique features
- High thermal conductivity: 2.4 W/mK
- Double-sided adhesive – quick and stable mounting
- Elongated format ideal for heatsinks and linear modules
- Temperature resistance: –60 °C to 200 °C
- Flexible structure that conforms to component surfaces
Properties and applications
- Applications: electronics, semiconductors, LED modules, power converters, industrial cooling
- Material: thermal pad with 2.4 W/mK conductivity and adhesive on both sides
- Electrical properties: volume resistivity 1×10¹¹ Ω/m, dielectric constant 5 (1 kHz)
- Format: 20 × 130 mm strip, 3.0 mm thick, ready for use
Technical parameters
| Parameter | Value |
|---|---|
| Dimensions | 20 × 130 × 3.0 mm |
| Thermal conductivity | 2.4 W/mK |
| Density at 20 °C | 2.9 g/cm³ |
| Hardness (Shore A) | 30 |
| Operating temperature | –60 °C to 200 °C |
| Volume resistivity | 1×10¹¹ Ω/m |
| Dielectric constant | 5 (1 kHz) |
| Adhesive layer | Double-sided |
| Shelf life | 3 years |
Storage recommendations
Store in a dry area, away from heat sources and direct sunlight. Keep in the original sealed packaging.
Product safety
Manufacturer
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
Responsible person in the EU
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
Reviews
If you've added a review and it doesn't appear on the list, it may be pending moderation.
Leave feedback on the product
Log in with Google
