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AG Thermopad TO247 23x18x0.3 mm 1.5 W/mK non-adhesive – thermal interface pad for transistors and power components

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Price: €0.39 0.39
Net price: €0.32
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Description

AG Thermopad TO247 23x18x0.3 mm (1.5 W/mK) non-adhesive is a flexible thermal interface pad designed for efficient heat dissipation and electrical insulation in electronic and industrial applications.

Advantages and unique features

  • High thermal conductivity: 1.5 W/mK
  • Electrical insulation with dielectric strength up to 6 V/m
  • Operating temperature range: –60 °C to 200 °C
  • Easy to apply – no adhesive needed
  • Excellent flexibility and mechanical durability

Properties and applications

  • Applications: TO-247 transistors, power supplies, cooling systems, power modules
  • Material: green non-adhesive thermal pad
  • Insulation properties: volume resistivity 1×10¹¹ Ω·m, dielectric constant 5 Hz
  • Safe and reusable: reduces short-circuit risks, easy to remove and reposition

Technical parameters

Parameter Value
Dimensions 23 × 18 × 0.3 mm
Color Green
Density at 20 °C 2 g/cm³
Thermal conductivity 1.5 W/mK
Thermal impedance 2.47 °C·in²/W
Heat capacity 1.0 J/(g·K)
Operating temperature –60 °C to 200 °C
Dielectric strength 6 V/m
Volume resistivity 1×10¹¹ Ω·m
Hardness (Shore A) 40
Shelf life 3 years

Storage recommendations

Store the product in a dry place, away from direct sunlight and heat sources. Keep in the original resealable packaging.

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