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AG Thermopad TO247 23x18x0.3 mm 1.5 W/mK non-adhesive – thermal interface pad for transistors and power components
Availability:
Available >20 pcs
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Product code:
AGT-242
Description
AG Thermopad TO247 23x18x0.3 mm (1 piece, 1.5 W/mK) non-adhesive is a flexible thermal interface pad designed for efficient heat dissipation and electrical insulation in electronic and industrial applications.
Advantages and unique features
- High thermal conductivity: 1.5 W/mK
- Electrical insulation with dielectric strength up to 6 V/m
- Operating temperature range: –60 °C to 200 °C
- Easy to apply – no adhesive needed
- Excellent flexibility and mechanical durability
Properties and applications
- Applications: TO-247 transistors, power supplies, cooling systems, power modules
- Material: green non-adhesive thermal pad
- Insulation properties: volume resistivity 1×10¹¹ Ω·m, dielectric constant 5 Hz
- Safe and reusable: reduces short-circuit risks, easy to remove and reposition
Technical parameters
| Parameter | Value |
|---|---|
| Quantity | 1 piece |
| Dimensions | 23 × 18 × 0.3 mm |
| Color | Green |
| Density at 20 °C | 2 g/cm³ |
| Thermal conductivity | 1.5 W/mK |
| Thermal impedance | 2.47 °C·in²/W |
| Heat capacity | 1.0 J/(g·K) |
| Operating temperature | –60 °C to 200 °C |
| Dielectric strength | 6 V/m |
| Volume resistivity | 1×10¹¹ Ω·m |
| Hardness (Shore A) | 40 |
| Shelf life | 3 years |
Storage recommendations
Store the product in a dry place, away from direct sunlight and heat sources. Keep in the original resealable packaging.
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