


AG Thermopad 30x30x1.0 mm 6 W/mK – thermal pad with adhesive for electronics and LED systems
Description
AG Thermopad 30x30x1.0 mm (6 W/mK) is a high-performance thermal interface pad with double-sided adhesive, designed for effective heat dissipation and fast mounting in electronics, LED systems, and industrial applications.
Advantages and unique features
- High thermal conductivity: 6 W/mK
- Double-sided adhesive layer – quick and stable installation
- Wide operating temperature range: –60 °C to 200 °C
- Excellent flexibility and surface conformity
- No need for additional mounting materials
Properties and applications
- Applications: computers, servers, LED systems, industrial cooling modules
- Material: flexible thermal pad with adhesive on both sides
- Dielectric properties: resistivity 1.1×10¹¹ Ω/m, dielectric constant 7.5 (1 kHz)
- Format: ready-to-use 30 × 30 mm square, 1.0 mm thick
Technical parameters
Parameter | Value |
---|---|
Dimensions | 30 × 30 × 1.0 mm |
Thermal conductivity | 6 W/mK |
Operating temperature | –60 °C to 200 °C |
Density at 20 °C | 3.0 ± 0.1 g/cm³ |
Hardness (Shore A) | 30 ± 5 |
Volume resistivity | 1.1×10¹¹ Ω/m |
Dielectric constant | 7.5 (1 kHz) |
Shelf life | 3 years |
Adhesive layer | Double-sided |
Storage recommendations
Store in a dry place away from heat sources and direct sunlight. Keep in the original resealable packaging.