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Gel flux 1.4ml in a syringe for SMT repair and assembly
Description
The 1.4 ml flux gel in a syringe is a concentrated No-Clean rosin flux RMA grade designed for SMT assembly and repair.
Advantages and unique features
- No-Clean formula – no washing required after soldering
- Printable for up to 36 h
- Maintains tackiness for 72 h for rework
- Gel consistency minimizes spreading
- Compatible with Ag, Cu, Au, Zn, Cd and SnPb surfaces
Properties and applications
- Appearance: amber paste
- Density (80 °C): ~1.0 g/cm³
- Flash point: > 150 °C
- Solubility: insoluble in water
- Shelf life: 3 years
- Use: SMT assembly and repair, soldering of precision electronic parts
- Application methods: 1.4 ml syringe, stencil, stencil printer, cartridge, reflow soldering
Technical parameters
| Parameter | Value |
|---|---|
| Packaging | 1.4 ml syringe |
| Formula | No-Clean RMA |
| Printable time | 36 h |
| Tackiness | 72 h |
| Density at 80 °C | ~1.0 g/cm³ |
| Flash point | > 150 °C |
| Water solubility | insoluble |
| Shelf life | 3 years |
Storage recommendations
Store in a cool, dry place in tightly closed containers, protected from direct sunlight and high temperatures.
Loctite Henkel Premium Partner
Free delivery from 600 EURO to EU Countries*
+48 509 336 666


