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Termopasty Easy Print Sn96.5Ag3Cu0.5 6 g lead-free solder paste
Description
Termopasty Easy Print Sn96.5Ag3Cu0.5 6 g lead-free solder paste for SMD soldering
Termopasty Easy Print Sn96.5Ag3Cu0.5 6 g is a lead-free solder paste in a syringe, designed for precise SMD soldering. The product is based on the Sn96.5Ag3Cu0.5 alloy, consisting of 96.5% tin, 3% silver and 0.5% copper. This composition makes the paste suitable for applications where controlled dosing, repeatability and high-quality solder joints are important.
The 6 g syringe format is especially practical for service work, prototyping, electronics repair and small-batch soldering. The syringe allows the paste to be applied directly onto solder pads or components, helping the user control the amount of material used during precise soldering tasks.
Applications of Easy Print Sn96.5Ag3Cu0.5 solder paste
Termopasty Easy Print Sn96.5Ag3Cu0.5 solder paste is intended for lead-free soldering of SMD components. It can be used in reflow soldering processes, both in normal atmosphere and in nitrogen. According to the manufacturer, the paste can also be used for printing on laser-cut or electroformed stencils.
The product is suitable for electronics, electrotechnics, electronic device servicing, prototype assembly, repair work and processes requiring accurate solder paste application on solder pads.
What distinguishes Termopasty Easy Print Sn96.5Ag3Cu0.5 6 g
The key feature of this product is the combination of the lead-free Sn96.5Ag3Cu0.5 alloy with a No Clean formula. This means that residues after soldering generally do not require cleaning. If residue removal is necessary, the manufacturer recommends using an alcohol-based PCB cleaner.
The paste is resistant to solder balling, provides good contour definition and is suitable for precision applications, including Fine Pitch components. According to the technical data, it remains printable for more than 8 hours and maintains tackiness for more than 24 hours.
When to choose Easy Print 6 g syringe solder paste
This variant is a good choice when a small amount of solder paste is needed for precise application. The 6 g syringe is practical for electronics servicing, PCB repairs, soldering small SMD components, laboratory work, prototyping and situations where a larger container would be unnecessary or inconvenient.
It is intended for professional users who need a solder paste with a confirmed alloy composition, defined technical parameters and suitability for lead-free reflow soldering processes.
Important information before use
The product is intended for professional use only. Before use, read the safety data sheet. The paste should be brought to room temperature before opening to reduce the risk of moisture condensation. Used paste should not be mixed with fresh paste, as this may affect its application properties.
The optimum application temperature is 23–26°C, with a maximum temperature of 28°C. For stencil printing, the manufacturer recommends using metal squeegees and a squeegee speed of 25–150 mm/s with a pressure of 1.5–3 N per cm of length.
Technical data of Termopasty Easy Print Sn96.5Ag3Cu0.5 6 g
| Parameter | Value |
|---|---|
| Manufacturer | AG TermoPasty |
| Product name | Easy Print Sn96.5Ag3Cu0.5 |
| Article number | ART.AGT-028 |
| EAN code | 5901764329251 |
| CN code | 3810 10 00 |
| Net content | 6 g |
| Packaging type | Syringe |
| Quantity in collective packaging | 5 pcs. |
| Product type | Lead-free No Clean solder paste |
| Application | SMD component soldering |
| Solder alloy | Sn96.5Ag3Cu0.5 |
| Alloy composition | 96.5% tin, 3% silver, 0.5% copper |
| Appearance | Grey paste |
| Odour | None |
| Density | approx. 4.6 g/cm³ |
| Particle size | 15–25 / 25–45 µm, depending on packaging variant |
| Tackiness | 1.0 G/mm² after 24 h |
| Printability | More than 8 h |
| Flux classification | REL-0 |
| Paper chromatography test for Cl | Meets REL-0 according to IPC TM 650 |
| Surface insulation resistance | >2.6 × 10¹⁰ Ω after 7 days, 85°C / 85% |
| Shelf life | 6 months |
| Standards | ISO 9454 type 1223, J-STD-004 REM-1 |
| CLP classification | Skin Sens. 1 H317, Repr. 1B H360Df |
| CLP signal word | Danger |
| Transport classification | Not subject to transport regulations |
Storage
Store at 3–7°C for no longer than 6 months. Keep the paste in tightly closed containers to prevent contamination. Before opening, allow the paste to reach room temperature to avoid moisture condensation and maintain proper product quality.
FAQ
Is Termopasty Easy Print Sn96.5Ag3Cu0.5 6 g a lead-free solder paste?
Yes. The product is based on the lead-free Sn96.5Ag3Cu0.5 alloy, containing 96.5% tin, 3% silver and 0.5% copper.
Is Easy Print 6 g suitable for SMD soldering?
Yes. The paste is intended for soldering SMD components and can be used in reflow soldering processes.
Does the PCB need to be cleaned after using this paste?
The paste is a No Clean product, so residues after soldering generally do not require cleaning. If residue removal is necessary, the manufacturer recommends using an alcohol-based PCB cleaner.
Why is the 6 g version supplied in a syringe?
The syringe makes it easier to apply small amounts of paste precisely onto solder pads or components. It is practical for electronics servicing, prototyping and soldering small SMD components.
At what temperature should Easy Print solder paste be applied?
The optimum application temperature is 23–26°C, with a maximum temperature of 28°C. The paste should be brought to room temperature before use.
Is this product intended for home users?
According to the manufacturer’s documentation, the product is intended for professional use only. Read the safety data sheet before use.
How long can Easy Print Sn96.5Ag3Cu0.5 be stored?
The shelf life is 6 months when stored at 3–7°C in tightly closed packaging.
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