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DOLPHON CX-1114-B 0.65 kg, epoxy hardener component B for potting and impregnation, 2-part DOLPHON C(a)-1114 system, blue, 100:13 mix ratio, UL94 V-0, 180°C thermal class

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Description

DOLPHON CX-1114-B 0.65 kg is a hardener (component B) for the two-part epoxy potting system DOLPHON C(a)-1114. The CX-1114-B variant is blue and is intended for potting and impregnating electrical components where thermal-cycle resistance and good electrical properties of the cured compound are required. The hardener must be used only after mixing with the compatible resin (component A) at the recommended ratios.

Advantages and unique features

  • Component B of a 2-part system for potting and impregnation of windings and electrical components
  • Blue colour variant (CX-1114-B) for clear visual control of the mix and potting
  • Cured system: excellent resistance to thermal cycles and good water resistance
  • Low shrinkage after curing (0.3%)
  • Self-extinguishing system: UL94 V-0 at 4 mm (file E317428)
  • Suitable up to class H applications; system thermal class (20,000 h): 180°C
  • Good heat dissipation (thermal conductivity after curing: 0.8 W/m·K)
  • EN 45545-2 certified (HL levels depending on R22/R23 requirements)

Properties and applications

  • Purpose: hardener for the DOLPHON C(a)-1114 epoxy potting/impregnation system
  • Cured system applications: windings, transformers, capacitors and electrical components; casting for stators, electrical magnets, electrical brakes, coils
  • Mix ratio (resin : hardener): 100 : 13 by weight and 100 : 22 by volume
  • Pot life at 25°C (100 g): 80–110 min (for the base 1114-B hardener)
  • Mixing: if sedimentation occurs, homogenize the resin; add the measured hardener and mix slowly without air entrapment (scrape vessel walls and bottom)
  • Pre-potting preparation: pre-heat the unit at 110–120°C for 3 h, then cool down to 40–50°C
  • Pouring tip: pour slowly into a corner of the mold so the resin rises gradually from bottom to top to help avoid trapped air
  • Curing: cures at room temperature; final properties can be reached faster by gelling at room temperature and then curing at 70°C for 3 h

Technical parameters

Parameter Value
Product epoxy hardener – component B of the 2-part DOLPHON C(a)-1114 system
Code / variant CX-1114-B
Colour blue
Pack size 0.65 kg
Recommended mix ratio (by weight) 100 : 13 (resin : hardener)
Recommended mix ratio (by volume) 100 : 22 (resin : hardener)
Hardener specific gravity at 25°C 970–1030 g/l (for the base 1114-B hardener)
Hardener viscosity (Brookfield) at 25°C 40–100 mPa·s (for the base 1114-B hardener)
Pot life at 25°C (100 g) 80–110 min (for the base 1114-B hardener)
System – shrinkage after curing 0.3%
System – thermal conductivity after curing 0.8 W/m·K
System – thermal class (20,000 h) 180°C
System – thermal cycles resistance 10 cycles: -60°C / +180°C
System – self-extinguishing UL94 V-0 (4 mm), file E317428
System – UL Insulating System 155°C E317429 (DV-155, table IX)
Certification EN 45545-2: HL1, HL2 for R22 and HL1, HL2, HL3 for R23

Storage recommendations

Store the hardener for up to 12 months in original sealed packaging, at a maximum of 30°C, protected from direct sunlight and heat sources. Before use, bring the product to application temperature and follow standard mixing rules for 2-part epoxy systems.

FAQ

1) Is DOLPHON CX-1114-B ready to use?
No. It is a hardener (component B) and must be mixed with the compatible resin (component A) of the DOLPHON C(a)-1114 system.

2) What mix ratio is recommended?
100 : 13 by weight and 100 : 22 by volume (resin : hardener).

3) What is the cured system used for?
Potting and impregnating windings, transformers, capacitors and electrical components, as well as casting parts such as stators or coils.

4) How can I reduce bubbles in the potting?
Pre-heat at 110–120°C for 3 h, cool to 40–50°C, and pour slowly into a corner of the mold to help avoid trapped air.

5) What is the shelf life and storage temperature?
Up to 12 months in sealed original packaging, at max. 30°C, away from sunlight and heat sources.

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