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Lead-free filler with flux Sn99.3Cu0.7-1.1.3/3.0% Ø 0.50 100 g (Cu1) for manual and automatic soft soldering, rosin tin
Lead-free filler with flux Sn99.3Cu0.7-1.1.3/3.0% Ø 0.70 100 g (Cu1) for manual and automatic soft soldering, rosin tin
Lead-free filler with flux Sn99.3Cu0.7-1.1.3/3.0% Ø 1.00 100 g (Cu1) for manual and automatic soft soldering, rosin tin
Lead-free soldering tin in a vial Sn99.3Cu0.7-SW26/2.5% Ø 1.00 10 g (Cu1) 0577-5
Lead-free soldering tin in a vial Sn99.3Cu0.7-SW26/2.5% Ø 1.00 14 g (Cu1) 0563-8
Lint-free cleaning swabs 122 mm – 20 pcs set for electronics, optics, PCBs and sensitive surfaces
Silicone filling 037 100g, 1kg two-component encapsulation, electronic system control, transparent
Silicone oil 100ml universal agent for protection against electric discharge, moisture
Smar TF 50 g silicone PTFE grease for printers scanners and electronics AG TermoPasty
Sodium persulfate B327 1L for etching and dissolving printed circuits
Sodium persulfate B327 250g for dissolving and etching printed circuit boards and copper, fine crystalline agent, fast dissolution
Sodium persulfate B327 500g for dissolving and etching printed circuit boards and copper, fine crystalline agent, fast dissolution
Soldering acid 100ml with brush, liquid for nitrile surfaces, strong action, oxide removal
Soldering acid 35 ml for nickel surfaces, active, water-washable, min. 28% non-volatile
Soldering acid 50ml with a brush, fluid for nitrile surfaces, strong action, removal of oxides
Soldering tin with flux in a vial Sn60Pb40-SW26/2.5% Ø 1.00 16 g, solder binder, electronics industry
Soldering tin with flux Sn60Pb40-SW26/2.5% Ø 0.70 250 g, solder binder, electronics industry
Soldering tin with flux Sn60Pb40-SW26/2.5% Ø 1.00 250 g, solder binder, electronics industry
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Loctite Henkel Premium Partner
Free delivery from 600 EURO to EU Countries*
+48 509 336 666


