Termopasty HP Thermal Conductive Paste 500 g cartridge 1.5 W/mK
Product code: AGT-327
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Termopasty HP Thermal Conductive Paste 500 g cartridge 1.5 W/mK
Termopasty HP Thermal Conductive Paste 500 g is a silicone thermal paste in a cartridge, designed to improve heat transfer between an electronic component and a heatsink or another cooling surface. The product has thermal conductivity of 1.5 W/mK, is electrically non-conductive and supports stable operation of electronic devices.
The 500 g version for article number ART.AGT-327 is intended for higher consumption in service departments, workshops and production applications. The cartridge format supports application during repetitive assembly and service work.
Applications of HP Thermal Conductive Paste 500 g
HP Thermal Conductive Paste 500 g can be used with processors, heatsinks, power modules, LEDs, power supplies, network devices, computer systems, household appliances and other components requiring improved heat transfer.
The product fills microscopic unevenness between the component surface and the heatsink. This improves thermal contact, reduces the risk of overheating and supports proper operating conditions for electronic circuits.
What distinguishes Termopasty HP Thermal Conductive Paste 500 g
HP paste has thermal conductivity of 1.5 W/mK, white colour and a density of 2.1 g/cm³ at 20°C. It works in a wide temperature range from -50°C to 250°C.
The product is electrically non-conductive, resistant to moisture and external influences. The manufacturer also indicates resistance to chemical substances such as acids, bases, salts, sulphur dioxide and ammonia.
When to choose HP Thermal Conductive Paste 500 g
The 500 g version is worth choosing when HP paste is used regularly and 7 g, 60 g or 100 g packages would be too small. The cartridge is practical for a larger number of applications and workstation use.
HP paste is a good choice for standard thermal transfer applications requiring a silicone paste with thermal conductivity of 1.5 W/mK. For more demanding applications requiring higher thermal conductivity, the HPX version may be considered.
How to use HP thermal conductive paste
Before application, clean and dry the component and heatsink surfaces. Apply a thin layer of paste to the contact surface, then install the cooling element according to the procedure for the device.
Do not apply too much paste. Excess material may reduce heat transfer efficiency. The layer should be thin, even and sufficient to fill microscopic unevenness between the surfaces.
Technical data of Termopasty HP Thermal Conductive Paste 500 g
| Parameter | Value |
|---|---|
| Manufacturer | AG TermoPasty |
| Product name | HP Thermal Conductive Paste |
| Article number | ART.AGT-327 |
| EAN code | 5901764322429 |
| Net content | 500 g |
| Packaging type | Cartridge |
| Collective packaging | 2 / 6 |
| Product type | Silicone thermal conductive paste |
| Thermal conductivity | 1.5 W/mK |
| Colour | White |
| Density at 20°C | 2.1 g/cm³ |
| Operating temperature range | from -50°C to 250°C |
| Electrical properties | Electrically non-conductive |
| Application | Processors, heatsinks, power modules, LEDs, electronics, network devices, cooling systems |
| Resistance | Moisture, external influences, acids, bases, salts, sulphur dioxide, ammonia |
| CN code | 3824 99 96 |
Storage
Store in a well-ventilated, cool and dry place. Keep the packaging tightly closed when the product is not in use. Protect from direct sunlight.
FAQ
What is Termopasty HP Thermal Conductive Paste 500 g used for?
The product is used to improve heat transfer between an electronic component and a heatsink or another cooling surface.
What is the thermal conductivity of HP paste?
The thermal conductivity of Termopasty HP paste is 1.5 W/mK.
Does HP paste conduct electricity?
No. HP paste is electrically non-conductive, so it can be used with electronic circuits requiring electrical insulation.
What temperature range does HP paste work in?
The product works in a temperature range from -50°C to 250°C.
Who is the 500 g cartridge intended for?
The 500 g version is intended for service departments, workshops and production applications where the paste is used more frequently or in larger quantities.
How does HP differ from HPX?
HP paste has thermal conductivity of 1.5 W/mK. The HPX version has higher thermal conductivity of >2.8 W/mK and is intended for more demanding applications.
How should HP thermal paste be applied?
Apply a thin, even layer of paste to a clean and dry contact surface between the component and the heatsink.
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