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Thermal Conductive Silicone Paste H for Electronics 7 g AG TermoPasty

Manufacturer: Termopasty (go to products)
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Thermal Conductive Silicone Paste H 7 g for Electronics and Heat Sinks

AG TermoPasty H 7 g is a silicone-based thermal conductive paste designed to improve thermal contact between electronic components and heat sinks or other cooling elements. It fills microscopic surface irregularities, reducing air gaps at the interface and helping transfer heat more efficiently.

With thermal conductivity above 0.88 W/mK, an operating temperature range from -50°C to 250°C and dielectric properties, Paste H is suitable for standard and industrial electronic applications where reliable heat transfer and electrical insulation are important.

Applications of Thermal Conductive Paste H

The paste is intended for components and devices requiring improved heat transfer between an electronic component and its cooling system, including:

  • high-power LEDs and LED modules,
  • power converters and electronic components,
  • motor control systems,
  • network communication equipment,
  • notebooks and desktop computers,
  • HDD and DVD drives,
  • consumer electronics and household appliances,
  • air conditioning equipment and other cooling systems.

Key Features of AG TermoPasty H

  • Thermal conductivity >0.88 W/mK – supports heat transfer from electronic components to heat sinks.
  • Operating temperature range from -50°C to 250°C – suitable for a wide range of operating conditions.
  • Dielectric properties – combines thermal conductivity with high electrical resistivity.
  • Chemical resistance – the manufacturer declares resistance to acids, alkalis, salts, sulfur dioxide and ammonia.
  • Material compatibility – chemically inert and suitable for most metals and plastics.
  • Non-flowing consistency – facilitates controlled application at the contact interface.

When to Choose Thermal Conductive Paste H

Paste H is a suitable choice when an economical thermal interface material is required for standard electronic applications, LED lighting, household appliances, motor control systems or industrial electronics. It is particularly useful where dielectric properties and a wide operating temperature range are important alongside heat transfer.

For more demanding CPU, GPU or high-power-density applications, consider comparing Paste H with AG TermoPasty HP or HPX, which offer higher thermal conductivity.

How to Apply AG TermoPasty H

Before application, ensure that the surfaces are clean and dry. Apply a thin, even layer of paste to the contact surface. Minimize air bubbles during spreading, as trapped air can reduce heat transfer efficiency.

After application, install the heat sink or other cooling component, ensuring proper contact between the surfaces. The 7 g tube allows direct application or spreading with a spatula.

Technical Specifications of AG TermoPasty H 7 g

Parameter Value
Product type Silicone-based thermal conductive paste
Appearance White paste
Thermal conductivity >0.88 W/mK
Operating temperature range -50°C to 250°C
Density at 20°C Approx. 2.58 g/cm³
Freezing point -50°C
Flash point 350°C
Specific heat at 50°C 0.243 cal/g·K
Viscosity / consistency Non-flowing
Refractive index 1.405
Volume resistivity ASTM D257 3.7 × 10¹³ Ω·m / 3.7 × 10¹⁵ Ω·cm
Dielectric dissipation factor tan δ ASTM D150 0.016 (120 Hz); 0.012 (1 kHz); 0.007 (10 kHz); 0.007 (100 kHz)
Relative dielectric permittivity εr ASTM D150 8 (120 Hz); 8.2 (1 kHz); 8 (10 kHz); 7.9 (100 kHz)
Packaging 7 g tube
Manufacturer article number ART.AGT-055
EAN 5901764320050
Shelf life 3 years

Storage

Store in a cool, dry and well-ventilated place. Keep the container tightly closed when not in use. Protect from direct sunlight.

Safety Information

For professional use only. Read the current Safety Data Sheet before use. The mixture is classified as hazardous to the aquatic environment: H410 – Very toxic to aquatic life with long lasting effects. Avoid release to the environment and dispose of residues in accordance with applicable waste management regulations.

FAQ

Does AG TermoPasty H conduct electricity?

Paste H has dielectric properties and high electrical resistivity. It is designed to transfer heat while providing electrical insulation.

Is Thermal Conductive Paste H 7 g suitable for computer processors?

The manufacturer lists computers and notebooks among its applications. However, with thermal conductivity above 0.88 W/mK, Paste H is primarily intended for standard applications. For more demanding CPUs and GPUs, consider HP or HPX pastes with higher thermal conductivity.

Can Paste H be used as an adhesive for heat sinks?

No. The paste improves thermal contact between surfaces but does not replace mechanical fastening. Heat sinks must be properly secured according to the device design.

Can Thermal Conductive Paste H be applied to metals and plastics?

The manufacturer describes the paste as chemically inert and suitable for use with most metals and plastics.

How should Thermal Conductive Paste H be applied?

Apply a thin, even layer to a clean and dry contact surface. Ensure proper coverage while minimizing air bubbles, then install and secure the heat sink.

Product safety

Manufacturer

AG TermoPasty

ul. Kolejowa 33E

18-218 Sokoły, Poland

+48 (86) 274 13 42 [email protected]

Responsible person in the EU

AG TermoPasty

ul. Kolejowa 33E

18-218 Sokoły, Poland

+48 (86) 274 13 42 [email protected]

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Thermal Conductive Silicone Paste H for Electronics 7 g AG TermoPasty