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Epoxy resin 041 two-component 100 g - electronics resin, component protection, insulation, circuit embedding, hermetization, resistance to moisture and chemical agents
Availability:
Available 4-10 pcs
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Product code:
AGT-223
Description
The two-component epoxy casting compound 141 100 g is a high-quality insulating material that, thanks to its excellent electrical insulation and mechanical properties, protects electronic components against moisture, dust, and external influences.
Benefits and Unique Features
- High hardness after curing – durable mechanical protection
- Excellent insulating properties – protects against electrical breakdown
- Surface is dry to the touch after curing – no stickiness or contamination
- Easy application and even distribution – even in hard-to-reach areas
- Safe formulation for sensitive surfaces – does not damage electronic parts
- Resistance to moisture, dust, and external influences – reliable protection in all conditions
Properties and Applications
- Appearance: Yellow liquid (component A) / Colorless liquid (component B) – allows visual control during application.
- Density at 25 °C: 1.16 g/cm³ (A) / ~0.98 g/cm³ (B) – ensures optimal spread and penetration into gaps.
- Gel time at 25 °C: approximately 33 minutes – allows precise positioning of components before curing.
- Hardness after curing: 95° Shore – guarantees a firm and durable coating.
- Dielectric strength: 20–25 kV/mm – provides effective electrical insulation. :contentReference[oaicite:1]{index=1}
- Shelf life: 12 months. :contentReference[oaicite:2]{index=2}
Technical Specifications
| Parameter | Value |
|---|---|
| Appearance | Yellow (A) / Colorless (B) |
| Density at 25 °C | 1.16 g/cm³ (A) / ~0.98 g/cm³ (B) |
| Viscosity at 25 °C | 900–1500 cP (A) |
| Amino value | Min. 1100 mg KOH/g (B) |
| Gel time at 25 °C | ~33 minutes |
| Hardness after curing | 95° Shore |
| Deflection temperature (Martens) | 50–55 °C |
| Compressive strength | 70–90 MPa (PN-EN ISO 604:2006) |
| Flexural strength | 80–100 MPa (PN-EN ISO 178:2006) |
| Adhesive bond compressive strength | Min. 10 MPa (PN-EN 1465:2003) |
| Adhesive bond shear strength | Min. 2.5 MPa (PN-ISO 15108:2002) |
| Dielectric strength | 20–25 kV/mm (PN-EN 60243:2002) |
| Packaging | 100 g metal tin (ART.AGT-223) |
Storage Recommendations
Store the casting compound in its original, tightly closed packaging in a dry, well-ventilated area at temperatures up to 25 °C, away from direct sunlight and heat sources. The product should not be exposed to temperatures exceeding 25 °C. :contentReference[oaicite:4]{index=4}
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