AG TermoPasty Epoxy Potting Compound 141 Two-Component 100 g for Electronics and Encapsulation
Product code: AGT-223
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Product description
AG TermoPasty Epoxy Potting Compound 141 for electronic encapsulation
AG TermoPasty Epoxy Potting Compound 141 is a two-component material designed for encapsulating and insulating electronic, electrical, telecommunication and radio components. After curing, it forms a hard yellow coating with very good electrical insulating properties and high mechanical strength.
IMPORTANT — for professional use only
Epoxy Potting Compound 141 is intended exclusively for professional users. Read the current safety data sheet before use and use appropriate personal protective equipment.
Applications of Epoxy Potting Compound 141
The product is intended for protecting components such as coils, transformers, capacitors, resistors, connectors and cable terminations. It can also be used in electrical equipment as an insulating and structural material.
The compound helps protect encapsulated components against moisture, dust and other external factors. It provides good adhesion to materials commonly used in electronics, including metals, glass and ceramics.
Properties
- very good electrical insulating properties,
- high hardness after curing,
- protection against moisture, dust and external factors,
- good adhesion to metals, glass and ceramics,
- dry surface after correct curing,
- curing at room temperature or by an accelerated process.
Preparation and mixing
Before application, the surface should be thoroughly cleaned of dust, grease and other contaminants and then degreased. For metal surfaces, the manufacturer recommends appropriately selected chemical etching to improve adhesion.
The components should be thoroughly mixed at room temperature in a weight ratio of 100 parts component A to 10 parts component B. The ART.AGT-223 set contains factory-proportioned quantities of 100 g of component A and 10 g of component B.
The material reaches full strength after approximately 7 days of curing at room temperature. The manufacturer also allows a two-stage process: 12 hours at room temperature followed by 6 hours at 80°C.
Epoxy Potting Compound 141 should not be used in contact with polystyrene, including Styroflex, because the material may be damaged by the components of the product.
Technical data
| Parameter | Value |
|---|---|
| Manufacturer | AG TermoPasty |
| Product | Epoxy Potting Compound 141 |
| Manufacturer SKU | ART.AGT-223 |
| Commercial variant | 100 g |
| Set contents | 100 g component A + 10 g component B |
| Mixing ratio A:B | 100:10 by weight |
| Appearance of component A | yellow liquid |
| Appearance of component B | colourless liquid |
| Density of component A at 25°C | 1.16 g/cm³ |
| Density of component B at 25°C | approx. 0.98 g/cm³ |
| Viscosity of component A at 25°C | 900–1500 cP |
| Gel time at 25°C | approx. 33 min |
| Consistency after curing | yellow hard solid |
| Shore A hardness after curing | 95 A |
| Martens heat deflection temperature | 50–55°C |
| Temperature resistance | 50°C |
| Dielectric strength | 20–25 kV/mm |
| Compressive strength | 70–90 MPa |
| Flexural strength | 80–100 MPa |
| Breaking stress | 40–60 MPa |
| Shelf life | 12 months |
Storage
Store in the original, tightly closed packaging in a dry and ventilated storage area at a temperature not exceeding 25°C. Protect from direct sunlight.
Safety
The product is intended exclusively for professional use. Read the current safety data sheet before use and use appropriate personal protective equipment. Do not use the product in any manner other than that specified by the manufacturer.
FAQ
What is Epoxy Potting Compound 141 used for?
It is used for potting, encapsulating and insulating electronic and electrical components, including coils, transformers, capacitors, resistors, connectors and cable terminations.
What is the mixing ratio?
Component A and the hardener should be mixed at a weight ratio of 100:10. The ART.AGT-223 set contains factory-proportioned quantities of 100 g of component A and 10 g of component B.
How long does Epoxy Potting Compound 141 take to cure?
The material reaches full strength after approximately 7 days at room temperature. The manufacturer also allows 12 hours at room temperature followed by 6 hours at 80°C.
Can Epoxy Potting Compound 141 be used with polystyrene?
No. The manufacturer states that polystyrene, including Styroflex, may be damaged by contact with the product.
What is the dielectric strength of Epoxy Potting Compound 141?
The manufacturer specifies a dielectric strength of 20–25 kV/mm for the cured material.
Is the product intended for consumers?
No. Epoxy Potting Compound 141 is intended exclusively for professional use.
How should Epoxy Potting Compound 141 be stored?
Store it in the original, tightly closed packaging in a dry and ventilated place at a temperature not exceeding 25°C and protect it from direct sunlight.
Product safety
Manufacturer
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
Responsible person in the EU
AG TermoPasty
ul. Kolejowa 33E
18-218 Sokoły, Poland
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