Lead-free soldering tin in a vial Sn99.3Cu0.7-SW26/2.5% Ø 1.00 10 g (Cu1) 0577-5

Lead-free soldering tin in a vial Sn99.3Cu0.7-SW26/2.5% Ø 1.00 10 g (Cu1) is a product that combines efficiency, environmental safety and universal application. The product is created in the first melting process of tin and copper, which guarantees its excellent quality and minimizes the occurrence of oxides. It is an ideal alternative to solders containing lead.

Properties:

• The product is manufactured in the first melting process of tin and copper, which ensures its high quality and eliminates the occurrence of oxides. It is a lead-free alloy, making it suitable for applications where lead-free soldering is required.
• The chemical composition of the product complies with the ISO 9453:2014 standard, which guarantees its quality and consistency.
• It is an excellent cost alternative to lead-based solders. This is particularly important in the context of compliance with regulations regarding lead content in products.
• The product does not contain silver, which may be important in applications where silver is not required.
• This solder meets the requirements of the RoHS directive, which means it is safe for the environment and contains no restricted substances.
• The product used in the product is halogen and based on modified rosin. This ensures very good solderability in popular applications in all industries.
• Flux residues after soldering do not have to be removed and can remain on the soldered surface, which facilitates the soldering process.
• The product can be used in both professional industrial and hobby applications.

Application:

• It is ideal for soldering in various industries, ensuring durable and reliable connections.
• The product can also be used by private individuals in hobby applications, such as soldering electronic or metal components.
• The filler metal is effective for soldering on most metal surfaces, except aluminum, its alloys and stainless steel.

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